Features
eInk Screen, Temperature sensor, Class-D audio power amplifier
Small size, Low price, Interesting
The MSP430F5529 Pocket Kit connect with TI MSP-EXP430F5529LP LaunchPad through the 40-pin BoosterPack expansion headers. The kit include: eINK screen, remote & local temperature sensor, class-D audio power amplifier and other ICs based on TI.
Mechanical keys & LED string
Capacitive touch
Temperature sensors TMP421
Audio signal processing based on TLV2764 & TPA2006D1
Digital audio processing based on DAC7571
Amplifier application/Filter Circuit/Power amplification
Motor control based on DRV8837
Current measurement based on INA210
Low power application: eINK screen & Super capacitor power supply
MSP430F5529 Pocket Kit ICs | |||
ICs | Connect to MCU | Labs | Knowledge |
Current-shunt monitor TI INA210 | ADC | l Current measure l LED control l Power measure | l Current monitor l ADC theory |
Operational amplifiler TI TLV2764 | PWM | l Low-pass/high-pass filter l Tone adjust l Signal Pre-amplifiler l SPWM signal generator | l Filter design l operational amplifiler l Pre-amplifiler theory l SPWM signal l PWM signal |
DAC converter TI DAC7571 | I2C bus | l Arbitrarily wave generator l Music replay | l DAC theory l I2C bus |
Class-D audio power amplifier TI TPA2006D1 | l Music replay with speaker l Power amplifer l BTL output | l Class-D amplifier l BTL output | |
Remote & local temperature sensor TI TMP421 | I2C bus | l Local/remote temperature measure l low power temperature measure system design | l Temperature measure l I2C bus |
H-Bridge Driver TI DRV8837 | PWM | l High power LED control l Monitor driver | l H-Bridge driver l PWM |
